Radiant Optronics                                      
A DEEP UV WAFER INSPECTION SYSTEM

- a bridging the gap between Scanning Electron Microscopy and Light Microscopy by extending Optical Resolution to sub - 0.15 µm

Decreasing features sizes of devices on semiconductor wafers and in other microelectronic components have created the need to extend the optical limits of inspection far below 1.00 µm. The Radiant Deep UV Microscope uses 350 nm optics, giving an unrivalled standard for light microscope imaging. The optical path provides unparelled image contrast with resolutions down to 0.15 µm.
Aberration free images are captured to a high resolution UV, CCD camera where they can be digitally processed, displayed, and of course stored to disc. The Radiant Deep UV Microscope is also equipped with a suite of standard imaging modilities including bright field, dark field and Differential Interference Contrast [DIC].
This comprehensive suite of imaging modalities can be further enhanced by optical addition of
   Confocal Imaging Module
   Near Infra Red [NIR] Imaging Module
- simplicity of operation is key
The Quick Focus Mode provides operator a range of selected imaging frame rates, as well as the selection of image gain and exposure settings for optimal real time imaging. All Quick Focus settings can be stored and recalled by simple, one button selection.
- image capture mode -
User selectable functions include
   image capture and enhancement
   selection of gain and frame integration rate
   image enhancement for optimum imaging
These settings can be stored and recalled by through the Quick Focus Mode.
   Line and Angle Measurements
   pseudo Color [RGB]
- manual control functions -
   Frame Integration of up to 17.5 seconds
   Frame Averaging
   Gain from 0 to 18 db
   Image Sharpening filter
   Image Contrast enhancements
   Image Brightness enhancements
   Auto gain and Exposure settings
- the sample stage, and other options -
For maximum versatility the Radiant Microscope can be equipped with a variety of mechanical or motorized stages to accommodate from 6 inch [150 mm] up to 12 inch [300 mm] wafers.
A Laser Marking system for ablation of silicon and metal is also available.

Please, contact us for more information !


UV image at 1,000x optical magnification showing 0.018 µm line width separation. Minimum contrast focus.

350 nm UV Image at 1,500x optical magnification.
350 nm UV Image at 2,000x optical magnification.