is the industry leader in component lead preparation services for the
Semiconductor and Aerospace industries. We have 40 years of experience
in lead forming of a wide variety of packages, including large and small
flat packs and quad packs, DIPs, fiberoptic headers and devices that
require conversion from through-hole to SMT. We use our unique universal
and dedicated tooling systems and complete process control to ensure
accuracy and quick turnaround of your parts to JEDEC/IPC and/or mil-spec
standard dimensions, with optional services such as package leak testing
and tinning if required.
are welcome to contact us to
discuss the best and most economical application for your need or
directly for deeper information of the tools.